From AI servers to new energy vehicles, from 5G RF to high-power LEDs — Shenzhen Puliante Electronic Technology Co., Ltd. provides engineers with full-scenario EMI shielding and thermal management materials.
From EMI shielding to thermal management and high-speed computing interconnect — covering the full life cycle of electronic devices. Featuring ultra-low profile copper foil (computing copper foil), CVD Carbon thermal film and Cu-carbon composite heat spreaders.
View All Products (31) →Our core thermal management product. Advanced fabrication process delivers ultra-high thermal conductivity and excellent electrical insulation — widely used for heat dissipation in AI chips, high-power LEDs and power modules.
Diamond microparticles precisely bonded with high-purity oxygen-free copper: thermal conductivity 550–950 W/m·K, with CTE flexibly tuned to match chip or ceramic packages. Custom shapes supported.
Grown by pure chemical vapor deposition as free-standing sheets or silicon-bonded films. Extremely high purity with thermal conductivity of 2000–2300 W/m·K. Key applications: near-junction cooling for AI chips, optical windows for high-power lasers, substrates for 5G mmWave devices and quantum computing packaging.
Our flagship product. PU foam core wrapped in conductive fabric offers excellent compression set and shielding effectiveness above 70 dB. Widely used for EMI gasketing and grounding in electronic enclosures.
Stamped from high-elasticity beryllium copper alloy with low contact resistance and long insertion cycles — ideal for EMC grounding and shielding in frequently-opened enclosures.
Flexible conductive material for irregular curved surfaces, cable wrapping and display panels. Die-cut to your drawing.
High-performance vacuum metallized films serving two major directions: display terminals (LCD/LED backlight modules, touch-screen shielding layers) and new energy (battery current collectors, pouch-cell packaging).
Fills microscopic gaps between heat-generating components and heatsinks to reduce interface thermal resistance — adaptable to heat dissipation needs at all power levels.
Custom metal shielding cans and high-frequency absorber materials that solve cavity resonance and band-specific electromagnetic interference.
Why are more and more engineers choosing Carbon thermal solutions?
| Material | Thermal Conductivity (W/m·K) | CTE (ppm/K) | Electrical Insulation | Typical Applications |
|---|---|---|---|---|
| Pure Copper | ~400 | 17 | ❌ | Traditional heatsinks |
| Aluminum Nitride (AlN) | 170-200 | 4.5 | ✅ | Ceramic substrates |
| Cu-Carbon Composite | 550-950 | 5-8 (tunable) | ❌ | IGBT / power modules |
| CVD Carbon Film ★ | 2000-2300 | 1.0-1.5 | ✅ | AI chips / 5G RF |
| Silicon (Si) | 150 | 2.6 | Semiconductor | Chip substrate (reference) |
CVD Carbon conducts heat 5–6× better than pure copper, with a CTE almost perfectly matched to silicon wafers (2.6 ppm/K)
From computing centers to new energy vehicles, from display terminals to aerospace
Near-junction cooling for GPU/CPU effectively solves hotspots in kilowatt-class chips, raising rack compute density by 30%+ while significantly cutting energy use.
Applied in 800V high-voltage platform IGBTs, SiC power modules and storage converters: 30% lower thermal resistance, smaller cooling systems and longer battery life.
Covering outdoor LED walls, laser projection and stage lighting: LED device lifetime extended by 50%+, with better luminous efficiency and operational stability.
CVD Carbon supports applications above 20 GHz, reducing thermal resistance in RF devices by 30%.
The lightweight nature of Carbon thermal materials significantly reduces aerospace payload and launch costs.
CVD Carbon film serves as both an optical window and a heat spreader, withstanding extreme thermal shock loads.
Mature processes that integrate seamlessly with existing production lines
Supports multiple standard bonding processes, compatible with existing SMT lines
Surfaces are professionally metallized and ready for the next process step
From materials to solutions — creating long-term value for our customers
Our own factory in Longhua, Shenzhen — no middleman markup. Small-batch samples and large-scale production both welcome.
Conductive foam, BeCu fingerstock, diamond thermal film, metallized film, shielding cans… one supplier covering all EMC + thermal management needs.
Customized to your size, shape and performance requirements — rapid prototyping, including non-standard parts.
Free samples, freight collect. Standard samples ship within 3 business days; custom-to-drawing prototyping supported
Shielding + thermal in one package: conductive foam, BeCu fingerstock, metallized film, diamond thermal film — one supplier for both material families
One-on-one engineer support for material selection and technical questions
Shenzhen Puliante Electronic Technology Co., Ltd.
Room 601, Building L, No.1 Xiawei Industrial Zone Road, Zhangkengjing Community, Guanhu Sub-district, Longhua District, Shenzhen, Guangdong, China